Kingston SODIMM KVR16S11S8/4WP DDR3 1600MHz 4GB RAM (1.5V)
ValueRAM's KVR16S11S8/4 is a 512M x 64-bit (4GB) DDR3-1600 CL11 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 512M x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 1.5V. This 204-pin SODIMM uses gold contact fingers. The electrical and mechanical specifications are as follows: JEDEC 1.5V Power Supply • VDDQ = 1.5V • 800MHz fCK for 1600Mb/sec/pin • 8 independent internal banks • Programmable CAS latency: 11, 10, 9, 8, 7, 6, 5 • Programmable Additive Latency: 0, CL - 2, or CL - 1 clock • 8-bit pre-fetch • Burst Length: 8 (interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write (either on the fly using A12 or MRS) • Bi-directional Differential Data Strobe • Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%) • On Die Termination using ODT pin • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°Cº • Asynchronous Reset • PCB: Height 1.180” (30.00mm), double sided component
HKD $275
Kingston SODIMM KVR16S11S8/4WP DDR3 1600MHz 4GB RAM (1.5V)
ValueRAM's KVR16S11S8/4 is a 512M x 64-bit (4GB) DDR3-1600 CL11 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 512M x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 1.5V. This 204-pin SODIMM uses gold contact fingers. The electrical and mechanical specifications are as follows: JEDEC 1.5V Power Supply • VDDQ = 1.5V • 800MHz fCK for 1600Mb/sec/pin • 8 independent internal banks • Programmable CAS latency: 11, 10, 9, 8, 7, 6, 5 • Programmable Additive Latency: 0, CL - 2, or CL - 1 clock • 8-bit pre-fetch • Burst Length: 8 (interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write (either on the fly using A12 or MRS) • Bi-directional Differential Data Strobe • Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%) • On Die Termination using ODT pin • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°Cº • Asynchronous Reset • PCB: Height 1.180” (30.00mm), double sided component
275